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| Nano Composite Thermal Compound
Specification:
* Thermal Conductivity: ＞2.8 W/m-K
* Thermal Resistance:<0.097 ℃-in2/W
* Specific Resistance: ＞2.5
* Operation Temperature: -50 ~ 240 ℃
* Weight: 6 g
INGREDIENTS
* Silicon Compound: 50%
* Carbon Compound: 20%
* Oxidized Metal Compound: 30% |
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